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Experienced Semiconductor Device Modeling Engineer New

1272834461

BOEING

Negotiable

Houston, United States

United States

Engineering

ASAP

12/10/2021

11/11/2021

Not specified

Permanent | Full Time

Job Description
At Boeing, we innovate and collaborate to make the world a better place. From the seabed to outer space, you can contribute to work that matters with a company where diversity, equity and inclusion are shared values. We’re committed to fostering an environment for every teammate that’s welcoming, respectful and inclusive, with great opportunity for professional growth. Find your future with us.
We are Boeing Research & Technology (BR&T): Boeing's global research and development team creating and implementing innovative technologies that make the impossible possible and enabling the future of aerospace. We are engineers and technicians, skilled scientists and bold innovators; Join us and put your passion, determination, and skill to work building the future! #TheFutureIsBuiltHere #ChangeTheWorld

Within BR&T, Boeing’s Solid State Electronics Development organization (SSED) performs microelectronics technology development and design for aerospace systems. We develop digital, analog, and RF Systems on Chip (SoCs) for radar, navigation, electronic warfare, communications, processing, quantum computing and other electronic systems. These systems are used on Boeing airborne, terrestrial, and satellite platforms. Designs are implemented with state of the art semiconductor process technologies including CMOS, GaAs, GaN, and SiGe. SSED uses external wafer fabrication but performs design (architecture, RTL, synthesis, circuits, physical design, verification, packaging and test) in house. SSED has numerous microelectronics projects, funded both by internal Boeing customers and external Government Science and Technology (S&T) customers. SSED’s large staff of microelectronics engineers conduct research and designs microelectronics hardware in support of these projects.

We are seeking experienced semiconductor device modeling engineers who are able to model CMOS transistor and other device behavior in extreme environments (e.g. cryogenic, extreme heat, and high radiation) in advanced semiconductor fabrication nodes (?32nm). Responsibilities include: adapting foundry-provided models for extreme environments based on experimental data and theoretical understanding of DC to multi-GHz AC behavior; creating new models based on measurement data; defining test structures and measurements needed to provide data to validate and calibrate models; predicting and explaining behavior of high-speed digital, analog/mixed-signal, and RF circuits using the developed device models.

There are positions available for levels 2 – 4

Position Responsibilities:
Level 2 - Maintains detailed requirements and specifications for various electronic products. Develops detailed designs of limited scope. Conducts various methods of testing and analysis to support design. Gathers data for technical performance measures and performs basic analysis. Provides basic engineering support throughout the lifecycle of the product. Conducts trade studies and literature research to support future product designs. Works under general supervision.

Level 3 - Analyzes customer and system requirements to develop basic architectural approaches and detailed specifications for various electronic products. Develops high-level and detailed designs consistent with requirements and specifications. Validates designs through various methods of review, testing and analysis. Identifies, tracks and statuses technical performance measures to measure progress and ensure compliance with requirements. Supports Supplier Management with make/buy recommendations and other technical services of limited scope. Provides engineering support throughout the lifecycle of the product. Investigates emerging technologies to develop concepts for future product designs to meet projected requirements. Works under general direction.

Level 4 - Leads analysis of customer and system requirements and development of architectural approaches and detailed specifications for various electronic products. Leads development of high-level and detailed designs consistent with requirements and specifications. Leads reviews of testing and analysis activity to assure compliance to requirements. Identifies, tracks and statuses technical performance measures to measure progress and ensure compliance with requirements. Leads activities in support of Supplier Management with make/buy recommendations and other technical services. Coordinates engineering support throughout the lifecycle of the product. Plans research projects to develop concepts for future product designs to meet projected requirements. Works under minimal direction.

This position allows for a hybrid work arrangement which is a combination of remote and on site work, generally includes routinely working virtually one or more days per week, schedules may vary by week

This position requires the ability to obtain a US Security Clearance for which the US Government requires US Citizenship as a condition of employment. An interim and/or final U.S. Secret Clearance Post-Start is required.

Basic Qualifications (Required Skills/Experience):
Bachelors, Masters or Doctorate of Science degree from an accredited course of study, in engineering, computer science, mathematics, physics or chemistry
Experience with semiconductor device physics
Experience with CMOS processing steps
Experience with process variation / mismatch models

Preferred Qualifications (Desired Skills and Experience):
3+ years of experience in the development and calibration of CMOS transistor models (using industry standard formats such as BSIM-BULK, BSIM-CMG, BSIM-IMG, BSIM-SOI, Gummel Poon, and VBIC) for digital, mixed-signal/analog, and RF integrated circuit applications.
Experience with industry-standard device modeling software, such as Keysight IC-CAP and Model Builder Program (MBP) for transistor characterization and modeling.
Experience with foundry-provided Process Design Kits (PDKs) and SPICE simulation for device model verification
Experience with advanced commercial semiconductor fabrication process technologies, including multi-gate (e.g. FinFET), silicon-on-insulator (SOI), and silicon germanium (SiGe) processes.
Experience with Technology computer-aided design (TCAD)
Experience with experimental process technologies (e.g. Gate-all-around FETs (GAAFETs))
Experience with design and test of electronics for extreme environments
A clear understanding of IC design flow from device-level modelling through library development and final chip-level design and verification.
Experience working on large-scale SoC design teams
Experience supporting military programs
Demonstrated track record as a self-motived, independent, high-performance team member
Excellent verbal and written communication ability
Experience organizing and leading teams
Active security clearance

Typical Education/Experience : Education/experience typically acquired through advanced technical education from an accredited course of study in engineering, computer science, mathematics, physics or chemistry (e.g. Bachelor) and typically 2 or more years' related work experience or an equivalent combination of technical education and experience (e.g. Master). In the USA, ABET accreditation is the preferred, although not required, accreditation standard.

Relocation : Relocation assistance is available for eligible candidates

Boeing is a Drug Free Workplace where post offer applicants and employees are subject to testing for marijuana, cocaine, opioids, amphetamines, PCP, and alcohol when criteria is met as outlined in our policies.

Shift : This position is for first shift



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